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logo1
  • Servies
    • Front Side Metallization Process
      • Chemical/Electro-less Plating
      • Metal-sputtering-deposition
    • Back Side Grinding Process
      • Taiko Grinding Total Solution
      • Wafer Thinning
    • Back Side Metallization Process
      • Metal-evaporation-deposition-for-backside-metallization
      • Thick Ag Process
      • Backside-metal-sputtering-deposition
    • IGBT Wafer Backend Process
      • IGBT Back Side Metal Sputtering Deposition
      • Backside Implantation
      • laser-annealing
    • Auto Optical Inspection
      • Auto-optical-inspection
    • Wafer Dicing Process
      • Blade Dicing Process
      • Laser Dicing Process
    • Wafer Sort Test Process
      • Wafer Sort Test Process
      • Test-platform
  • Tech Library
  • About ProPowertek
    • Company Profile
    • Awards-accreditations
    • Corporate Social Responsibility
  • Press room
  • Careers
    • Choose-propowertek
    • Join ProPowertek
    • Come to ProPowertek
  • Investors
  • Contact us
  • English
    • 繁體中文
    • 简体中文
    • English

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新聞活動3

ProPowertek makes a breakthrough in 1.5 Mil Taiko Wafer with High Wafer Strength

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2021 年 1 月 6 日

2021-01-06 ProPowertek With the booming development of 5G, IoT and electric vehicles, the requirements for low power consumption are getting more and more

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Prosperity Power Technology Inc.
Mr. Yu / Stan
Tel:+886-3-579-9209 #5888
Fax:+886-3-577-8900
Customer service:stan_yu@propowertek.com
Address:No. 15, Yuanqu 2nd Rd., East Dist., Hsinchu City 300, Taiwan (R.O.C.)

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